Ambient light sensing display assemblies

ABSTRACT

Systems, methods, and computer-readable media for sensing ambient light with a display assembly are provided. A display assembly may include at least one light-generating component and at least one light-detecting component, each of which may be positioned underneath a single opening in an electronic device housing.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of prior filed U.S. ProvisionalPatent Application No. 62/738,494, filed Sep. 28, 2018, which is herebyincorporated by reference herein in its entirety.

TECHNICAL FIELD

This disclosure relates to ambient sensing display assemblies.

Background of the Disclosure

An electronic device (e.g., a laptop computer, a cellular telephone,etc.) may be provided with a display assembly that consumes a majorityof an external device surface. However, heretofore, such displayassemblies have prevented adequate ambient light sensing with suchdisplay assemblies.

Summary of the Disclosure

This document describes systems, methods, and computer-readable mediafor sensing ambient light with a display assembly.

For example, an electronic device is provided that may include a displayassembly including an external display surface, a light-emitting diodeoperative to emit light for illuminating the external display surface,and a light-sensing diode operative to detect light passing through theexternal display surface, wherein an organic element of thelight-emitting diode and an organic element of the light-sensing diodelie in a single layer extending along and underneath the externaldisplay surface.

As another example, an electronic device is provided that may include ahousing, a processor within the housing, and a display assembly that mayinclude an external display surface exposed through an opening in thehousing, a light-emitting component controllable by the processor toemit light for illuminating the external display surface, and alight-sensing component controllable by the processor to detect lightpassing through the external display surface.

As yet another example, a method for providing ambient light sensingover a surface area is provide that may include emitting visible lightfrom a first plurality of locations arranged underneath the surface areaand detecting ambient light at a second plurality of locations arrangedunderneath the surface area.

As yet another example, a method for operating a display assembly of anelectronic device that includes an external surface of an externalcomponent and a processor component, where the display assembly includesa plurality of light-generating components and a plurality oflight-detecting components, is provided that may include operating, withthe processor component, at least a subset of the plurality oflight-generating components to create a visible image via the externalsurface, concurrently with the operating the at least the subset of theplurality of light-generating components, operating, with the processorcomponent, at least a subset of the plurality of light-detectingcomponents to receive ambient light via the external surface, andreceiving, with the processing component, one or more results signalsbased on the received ambient light.

As yet another example, a method for manufacturing a light-sensingdisplay assembly is provided that may include forming a semiconductorprocessing layer and combining a plurality of display element cells andat least one light-sensing cell in the semiconductor processing layer,wherein the display element cells are configured to emit or controlvisible light for displaying images at a display and the at least onelight-sensing cell is configured to detect visible light passed throughthe display.

As yet another example, an electronic device is provided that mayinclude a housing, a processor within the housing, and a displayassembly including an external display surface exposed through anopening in the housing, and a pixel including an element controllable bythe processor to alternate between illuminating the external displaysurface and detecting light passing through the external displaysurface.

This Summary is provided only to summarize some example embodiments, soas to provide a basic understanding of some aspects of the subjectmatter described in this document. Accordingly, it will be appreciatedthat the features described in this Summary are only examples and shouldnot be construed to narrow the scope or spirit of the subject matterdescribed herein in any way. Other features, aspects, and advantages ofthe subject matter described herein will become apparent from thefollowing Detailed Description, Figures, and Claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The discussion below makes reference to the following drawings, in whichlike reference characters may refer to like parts throughout, and inwhich:

FIG. 1 is a schematic view of an illustrative an electronic device witha light sensing display assembly;

FIG. 1A is a front, left, bottom perspective view of the electronicdevice of FIG. 1, in accordance with some embodiments;

FIG. 1B is a back, right, bottom perspective view of the electronicdevice of FIGS. 1 and 1A, in accordance with some embodiments;

FIG. 1C is a cross-sectional view, taken from line IC-IC of FIG. 1A, ofthe electronic device of FIGS. 1-1B, in accordance with someembodiments;

FIG. 1D is a cross-sectional view, similar to FIG. 1C, of the electronicdevice of FIGS. 1-1C, but with a particular light sensing displayassembly, in accordance with some embodiments;

FIG. 1E is a cross-sectional view, similar to FIGS. 1C and 1D, of theelectronic device of FIGS. 1-1C, but with another particular lightsensing display assembly, in accordance with some embodiments;

FIG. 1F is a front view, taken from line IF-IF of FIG. 1D, of theelectronic device of FIGS. 1-1D, in accordance with some embodiments;

FIG. 1G is a cross-sectional view, similar to FIGS. 1C, 1D, and 1E, ofthe electronic device of FIGS. 1-1C, but with another particular lightsensing display assembly, in accordance with some embodiments;

FIG. 1H is a front view, taken from line IH-IH of FIG. 1G, of theelectronic device of FIGS. 1-1C and 1G, in accordance with someembodiments;

FIG. 1I is a schematic view of an exemplary light-generating componentof the display assembly of the electronic device of FIGS. 1-1H, inaccordance with some embodiments;

FIG. 1J is a schematic view of an exemplary light-detecting component ofthe display assembly of the electronic device of FIGS. 1-1H, inaccordance with some embodiments;

FIG. 2 is a cross-sectional view, similar to a portion of FIGS. 1C, 1D,1E, and 1G, of a portion of another display assembly, in accordance withsome embodiments; and

FIGS. 3-5 are flowcharts of illustrative processes for sensing lightwith a display assembly.

DETAILED DESCRIPTION OF THE DISCLOSURE

Systems, methods, and computer-readable media may be provided forsensing ambient light with a display assembly. The display assembly mayinclude at least one light-generating component and at least onelight-detecting component, each of which may be positioned underneath asingle opening in an electronic device housing. An external surface ofan external component (e.g., cover glass) may be exposed through such ahousing opening, while at least one light-generating component of thedisplay assembly may be configured to selectively emit light onto theexternal component and at least one light-detecting component of thedisplay assembly may be configured to selectively detect ambient lightpassing through the external component. At least one light-detectingcomponent and at least one light-generating component of such a displayassembly may be provided in a single layer underneath the externalcomponent. For example, organic materials of an organic light emittingdiode of a light-generating component and organic materials of anorganic photodiode of a light-detecting component may be providedadjacent one another in a single layer. In some embodiments, the displayassembly may include a selection subassembly that may be operative toselectively enable or otherwise control functionality of one, some, oreach light-generating component of the display assembly and/or one,some, or each light-detecting component of the display assembly. Forexample, the selection subassembly may be provided by a thin filmtransistor (TFT) layer, and at least a portion of at least onelight-detecting component of the display assembly may be provided inthat layer (e.g., by an amorphous silicon detector in a TFT controllayer that may be provided above or below a layer in which at least onelight-generating component of the display assembly may be provided).This may obviate the need for an ambient light sensor assembly that isdistinct from a display assembly in an electronic device.

FIG. 1 is a schematic view of an illustrative electronic device 100 thatmay include an ambient light sensing display assembly. Electronic device100 can include, but is not limited to, a music player (e.g., an iPod™available by Apple Inc. of Cupertino, Calif.), video player, still imageplayer, game player, other media player, music recorder, movie or videocamera or recorder, still camera, other media recorder, radio, medicalequipment, domestic appliance, transportation vehicle instrument,musical instrument, calculator, cellular telephone (e.g., an iPhone™available by Apple Inc.), other wireless communication device, personaldigital assistant, remote control, pager, computer (e.g., a desktop(e.g., an iMac™ available by Apple Inc.), laptop (e.g., a MacBook™available by Apple Inc.), tablet (e.g., an iPod™ available by AppleInc.), server, etc.), monitor, television, stereo equipment, set up box,set-top box, boom box, modem, router, printer, or any combinationthereof. Electronic device 100 may be any portable, mobile, hand-held,or miniature electronic device that may be configured to sense ambientlight with its display assembly wherever a user travels. Some miniatureelectronic devices may have a form factor that is smaller than that ofhand-held electronic devices, such as an iPod™. Illustrative miniatureelectronic devices can be integrated into various objects that mayinclude, but are not limited to, watches (e.g., an Apple Watch™available by Apple Inc.), rings, necklaces, belts, accessories forbelts, headsets, accessories for shoes, virtual reality devices,glasses, other wearable electronics, accessories for sporting equipment,accessories for fitness equipment, key chains, or any combinationthereof. Alternatively, electronic device 100 may not be portable atall, but may instead be generally stationary.

As shown in FIG. 1, for example, electronic device 100 may include aprocessor 102, memory 104, a communications component 106, a powersupply 108, an input component 110, and an output component 112.Electronic device 100 may also include a bus 114 that may provide one ormore wired or wireless communication links or paths for transferringdata and/or power to, from, or between various other components ofdevice 100. In some embodiments, one or more components of electronicdevice 100 may be combined or omitted. Moreover, electronic device 100may include any other suitable components not combined or included inFIG. 1 and/or several instances of the components shown in FIG. 1. Forthe sake of simplicity, only one of each of the components is shown inFIG. 1.

Memory 104 may include one or more storage mediums, including forexample, a hard-drive, flash memory, permanent memory such as read-onlymemory (“ROM”), semi-permanent memory such as random access memory(“RAM”), any other suitable type of storage component, or anycombination thereof. Memory 104 may include cache memory, which may beone or more different types of memory used for temporarily storing datafor electronic device applications. Memory 104 may be fixedly embeddedwithin electronic device 100 or may be incorporated onto one or moresuitable types of components that may be repeatedly inserted into andremoved from electronic device 100 (e.g., a subscriber identity module(“SIM”) card or secure digital (“SD”) memory card). Memory 104 may storemedia data (e.g., music and image files), software (e.g., forimplementing functions on device 100), firmware, preference information(e.g., media playback preferences), lifestyle information (e.g., foodpreferences), exercise information (e.g., information obtained byexercise monitoring equipment), transaction information (e.g., creditcard information), wireless connection information (e.g., informationthat may enable device 100 to establish a wireless connection),subscription information (e.g., information that keeps track of podcastsor television shows or other media a user subscribes to), contactinformation (e.g., telephone numbers and e-mail addresses), calendarinformation, pass information (e.g., transportation boarding passes,event tickets, coupons, store cards, financial payment cards, etc.), anyother suitable data, or any combination thereof.

Communications component 106 may be provided to allow device 100 tocommunicate with one or more other electronic devices or servers orother remote entities using any suitable communications protocol. Forexample, communications component 106 may support WiFi™ (e.g., an 802.11protocol), ZigBee™ (e.g., an 802.15.4 protocol), WiDi™, Ethernet,Bluetooth™, Bluetooth™ Low Energy (“BLE”), high frequency systems (e.g.,900 MHz, 2.4 GHz, and 5.6 GHz communication systems), infrared,transmission control protocol/internet protocol (“TCP/IP”) (e.g., any ofthe protocols used in each of the TCP/IP layers), Stream ControlTransmission Protocol (“SCTP”), Dynamic Host Configuration Protocol(“DHCP”), hypertext transfer protocol (“HTTP”), BitTorrent™, filetransfer protocol (“FTP”), real-time transport protocol (“RTP”),real-time streaming protocol (“RTSP”), real-time control protocol(“RTCP”), Remote Audio Output Protocol (“RAOP”), Real Data TransportProtocol™ (“RDTP”), User Datagram Protocol (“UDP”), secure shellprotocol (“SSH”), wireless distribution system (“WDS”) bridging, anycommunications protocol that may be used by wireless and cellulartelephones and personal e-mail devices (e.g., Global System for MobileCommunications (“GSM”), GSM plus Enhanced Data rates for GSM Evolution(“EDGE”), Code Division Multiple Access (“CDMA”), OrthogonalFrequency-Division Multiple Access (“OFDMA”), high speed packet access(“HSPA”), multi-band, etc.), any communications protocol that may beused by a low power Wireless Personal Area Network (“6LoWPAN”) module,any suitable cellular communications protocol (e.g., broadband cellularnetwork technologies (e.g., 3G, 4G, 5G, etc.)), any other communicationsprotocol, or any combination thereof. Communications component 106 mayalso include or may be electrically coupled to any suitable transceivercircuitry that can enable device 100 to be communicatively coupled toanother device (e.g., a server, host computer, scanner, accessorydevice, etc.) with that other device wirelessly, or via a wiredconnection (e.g., using a connector port). Communications component 106may be configured to determine a geographical position of electronicdevice 100 and/or any suitable data that may be associated with thatposition. For example, communications component 106 may utilize a globalpositioning system (“GPS”) or a regional or site-wide positioning systemthat may use cell tower positioning technology or Wi-FiTM technology, orany suitable location-based service or real-time locating system, whichmay leverage a geo-fence for providing any suitable location-based datato device 100.

Power supply 108 can include any suitable circuitry for receiving and/orgenerating power, and for providing such power to one or more of theother components of electronic device 100. For example, power supply 108can be coupled to a power grid (e.g., when device 100 is not acting as aportable device or when a battery of the device is being charged at anelectrical outlet with power generated by an electrical power plant). Asanother example, power supply 108 can be configured to generate powerfrom a natural source (e.g., solar power using solar cells). As anotherexample, power supply 108 can include one or more batteries forproviding power (e.g., when device 100 is acting as a portable device).

One or more input components 110 may be provided to permit a user ordevice environment to interact or interface with device 100. Forexample, input component 110 can take a variety of forms, including, butnot limited to, a touch pad, dial, click wheel, scroll wheel, touchscreen, one or more buttons (e.g., a keyboard), mouse, joy stick, trackball, microphone, camera, scanner (e.g., a barcode scanner or any othersuitable scanner that may obtain product identifying information from acode, such as a linear barcode, a matrix barcode (e.g., a quick response(“QR”) code), or the like), proximity sensor, light detector (e.g.,ambient light sensor), biometric sensor (e.g., a fingerprint reader orother feature recognition sensor, which may operate in conjunction witha feature-processing application that may be accessible to electronicdevice 100 for authenticating a user), line-in connector for data and/orpower, and combinations thereof. An input component may be any suitablesensor assembly that may take one of various forms, including, but notlimited to, any suitable temperature sensor (e.g., thermistor,thermocouple, thermometer, silicon bandgap temperature sensor, bimetalsensor, etc.) for detecting the temperature of a portion of electronicdevice 100, a performance analyzer for detecting an applicationcharacteristic related to the current operation of one or morecomponents of electronic device 100 (e.g., processor 102), one or moresingle-axis or multi-axis accelerometers, angular rate or inertialsensors (e.g., optical gyroscopes, vibrating gyroscopes, gas rategyroscopes, or ring gyroscopes), magnetometers (e.g., scalar or vectormagnetometers), pressure sensors, light sensors (e.g., ambient lightsensors (“ALS”), infrared (“IR”) light sensors, ultraviolet (“UV”) lightsensors, etc.), linear velocity sensors, thermal sensors, microphones,proximity sensors, capacitive proximity sensors, acoustic sensors, sonicor sonar sensors, radar sensors, image sensors, video sensors, globalpositioning system (“GPS”) detectors, radio frequency (“RF”) detectors,RF or acoustic Doppler detectors, RF triangulation detectors, electricalcharge sensors, peripheral device detectors, event counters, and anycombinations thereof. Each input component 110 can be configured toprovide one or more dedicated control functions for making selections orissuing commands associated with operating device 100.

Electronic device 100 may also include one or more output components 112that may present information (e.g., graphical, audible, and/or tactileinformation) to a user of device 100. For example, output component 112of electronic device 100 may take various forms, including, but notlimited to, audio speakers, headphones, line-out connectors for dataand/or power, visual displays (e.g., for transmitting data via visiblelight and/or via invisible light), infrared ports, flashes (e.g., lightsources for providing artificial light for illuminating an environmentof the device), tactile/haptic outputs (e.g., rumblers, vibrators,etc.), and combinations thereof. As a specific example, electronicdevice 100 may include a display assembly output component as outputcomponent 112, where such a display assembly output component mayinclude any suitable type of display or interface for presenting visualdata to a user with visible light. A display assembly output componentmay include a display embedded in device 100 or coupled to device 100(e.g., a removable display). A display assembly output component mayinclude, for example, a liquid crystal display (“LCD”), which mayinclude any suitable backlight or other light source that may or may notuse one or any other suitable number of light emitting diodes (“LEDs”),a light emitting diode (“LED”) display, a plasma display, an organiclight-emitting diode (“OLED”) display, a micro-LED display, a nano-LEDdisplay, a surface-conduction electron-emitter display (“SED”), a carbonnanotube display, a nanocrystal display, any other suitable type ofdisplay, or combination thereof. Alternatively, a display assemblyoutput component can include a movable display or a projecting systemfor providing a display of content on a surface remote from electronicdevice 100, such as, for example, a video projector, a head-up display,or a three-dimensional (e.g., holographic) display. As another example,a display assembly output component may include a digital or mechanicalviewfinder, such as a viewfinder of the type found in compact digitalcameras, reflex cameras, or any other suitable still or video camera. Adisplay assembly output component may include display driver circuitry,circuitry for driving display drivers, or both, and such a displayassembly output component can be operative to display content (e.g.,media playback information, application screens for applicationsimplemented on electronic device 100, information regarding ongoingcommunications operations, information regarding incoming communicationsrequests, device operation screens, etc.) that may be under thedirection of processor 102. In some embodiments, a display assemblyoutput component may include a single or only a few light sources (e.g.,one or a few LEDs) that may provide sufficient light for enabling amulti-pixel display and/or that may provide a single display object((e.g., an illuminated logo or status light (e.g., when a single lightsource shines through a light-transmissive portion of housing 101 ofdevice 100))).

It should be noted that one or more input components and one or moreoutput components may sometimes be referred to collectively herein as aninput/output (“I/O”) component or I/O interface (e.g., input component110 and output component 112 as I/O component or I/O interface). Forexample, input component 110 and output component 112 may sometimes be asingle I/O interface 111, such as a touch screen that may receive inputinformation through a user's touch of a display screen and that may alsoprovide visual information to a user via that same display screen,and/or such as an ambient light sensing display assembly that may detectambient light (e.g., from the environment of device 100) and that mayalso emit light (e.g., graphical information to a user) via that samedisplay assembly.

Processor 102 of electronic device 100 may include any suitableprocessing circuitry that may be operative to control the operations andperformance of one or more components of electronic device 100. Forexample, processor 102 may receive input signals from one or more inputcomponents 110 and/or drive output signals through one or more outputcomponents 112. As shown in FIG. 1, processor 102 may be used to run oneor more applications, such as an application 103. Application 103 mayinclude, but is not limited to, one or more operating systemapplications, firmware applications, media playback applications, mediaediting applications, pass applications, calendar applications, statedetermination applications, biometric feature-processing applications,compass applications, health applications, thermometer applications,weather applications, thermal management applications, video gameapplications, or any other suitable applications. For example, processor102 may load application 103 as a user interface program to determinehow instructions or data received via an input component 110 and/or anyother component of device 100 (e.g., communications component 106 and/orpower supply 108) may manipulate the one or more ways in whichinformation may be stored at memory 104 and/or provided to a user or theambient environment via an output component 112 and/or to a remotedevice via a communications component 106. Application 103 may beaccessed by processor 102 from any suitable source, such as from memory104 (e.g., via bus 114) or from another device or server or any othersuitable remote source via communications component 106. Processor 102may include a single processor or multiple processors. For example,processor 102 may include at least one “general purpose” microprocessor,a combination of general and special purpose microprocessors,instruction set processors, graphics processors, video processors,and/or related chips sets, and/or special purpose microprocessors.Processor 102 also may include on board memory for caching purposes.

Electronic device 100 may also be provided with a housing 101 that mayat least partially enclose one or more of the components of device 100for protection from debris and other degrading forces external to device100. In some embodiments, one or more of the components may be providedwithin its own housing (e.g., input component 110 may be an independentkeyboard or mouse within its own housing that may wirelessly or througha wire communicate with processor 102, which may be provided within itsown housing).

FIGS. 1A-1J are various views of various portions of electronic device100 in accordance with some embodiments. As shown, electronic device 100may include an ambient light sensing display assembly I/O interface 111a, which may include an ambient light sensor assembly input component110 a and a display assembly output component 112 a with or without atouch screen assembly input component 110 c, a button assembly inputcomponent 110, and an audio speaker assembly output component 112 b,where housing 101 may be configured to at least partially enclose eachof those input components and output components of device 100. Housing101 may be any suitable shape and may include any suitable number ofwalls. In some embodiments, as shown in FIGS. 1A-1J, for example,housing 101 may be of a generally hexahedral shape and may include a topwall 101 t, a bottom wall 101 b that may be opposite top wall 101 t, aleft wall 1011, a right wall 101 r that may be opposite left wall 1011,a front wall 101 f, and a back wall 101 k that may be opposite frontwall 101 f, where at least a portion of light sensing display assemblyI/O interface 111 a may be at least partially exposed to the externalenvironment via an opening 109 a through front wall 101 f, where atleast a portion of button assembly input component 110 b may be at leastpartially exposed to the external environment via an opening 109 bthrough front wall 101 f, and where at least a portion of audio speakerassembly output component 112 b may be at least partially exposed to theexternal environment via an opening 109 c through front wall 101 f. Itis to be understood that electronic device 100 may be provided with anysuitable size or shape with any suitable number and type of componentsother than as shown in FIGS. 1A-1J, and that the embodiments of FIGS.1A-1J are only exemplary.

As shown in FIG. 1C, I/O interface assembly 111 a may include anexternal component 120 that may provide an external surface 121 that maybe exposed to the external environment of electronic device 100 viahousing opening 109 a, such that external surface 121 may be touched orotherwise affected by a user U or any other object or element (e.g.,fluid, heat, ambient light (e.g., any suitable ambient light AL from anysuitable ambient light source ALS), etc.) of the external environment ofelectronic device 100. In some embodiments, external component 120 maybe a cover glass (e.g., an alkali-aluminosilicate sheet toughened glass,sapphire glass, etc.) or any other suitable material structure that mayprovide external surface 121 suitable for interfacing with the externalenvironment and/or suitable for receiving ambient light thereon and/ortherethrough (e.g., for detection by any suitable circuitry of device100) and/or transmitting light therethrough and/or therefrom (e.g., fordetection by user U or any other object of the external environment),where the material structure may include any suitable coating thereon(e.g., an oleophobic coating that may reduce the accumulation offingerprints on external surface 121).

I/O interface assembly 111 a may include a display assembly 130 (e.g.,of display assembly output component 112 a) underneath externalcomponent 120. Display assembly 130 may be any suitable display assemblytype that may include a light-emitting subassembly 140 that may beoperative to generate and emit light that may be used to selectivelyilluminate at least a portion of external surface 121 (e.g., along thedirection of arrow EL1, such as to emit light through external surface121 (e.g., towards user U of device 100)). Light-emitting subassembly140 may include at least one light-emitting diode or any other suitablelight-emitting or light-generating element or light-generating component142. Power supply 108 may be configured to provide power selectively toone, some, or each light-generating component 142 for enabling thegeneration and emittance of light therefrom (e.g., via any suitablelight-generating selection circuitry (e.g., via any suitablelight-generating selection circuitry 164 of a selection subassembly 160of display assembly 130 that may be electrically coupled to thelight-generating component via any suitable coupling (e.g., bus 114))).In some embodiments, as shown in FIG. 1I, for example, light-generatingcomponent 142 may include any suitable light-emitting element 141 (e.g.,any suitable light emitting diode D) with a first pin or node 141 a anda second pin or node 141 b that may be coupled to circuitry 164, whichmay include a first node O1 and a second node O2. As shown, a current(e.g., current I) may flow through light-generating component 142 (e.g.,as may be enabled by a power supply coupled to nodes O1 and O2 ofcircuitry 164 or as may be enabled by a current source component 160 iof circuitry 164). Moreover, in some embodiments, as shown, for example,circuitry 164 may include any resistance element 160 r or combination ofresistance elements (e.g., any suitable resistor R), which may beprovided (e.g., in series with light-emitting element 141) with aparticular resistance for enabling an appropriate value for theoperating current of light-generating component 142, such that light(e.g., light EL) may be emitted from a semiconductor junction J orotherwise of light-emitting element 141 (e.g., at a p-n junction orotherwise of anode A and cathode C of light emitting diode D). A forwardvoltage V_(f) of light-generating component 142 (e.g., of light-emittingelement 141) may be detected or otherwise measured (e.g., across nodes141 a and 141 b) by circuitry 164 (e.g., alone or in combination withany other suitable circuitry of selection subassembly 160 and/or withany suitable processing by processor 102). Light-generating component142 may include any suitable light-emitting element 141, which may beany suitable light-emitting diode, including, but not limited to, aninorganic light-emitting diode, an organic light-emitting diode, a highbrightness light-emitting diode, a micro-light-emitting diode, anano-light-emitting diode, and the like. In some embodiments, node O2may be coupled to ground or any other suitable element. While FIG. 1Imay show circuitry 164 to include a high side current source (e.g.,current source component 160 i may be coupled to anode A of LED D),circuitry 164 may include a low side current sink (e.g., a current sinkmay be operative to pull current from light-emitting element 141 (e.g.,from cathode C of LED D)).

Display assembly 130 may include one or more other components, such asany suitable light-generating selection circuitry 164 of selectionsubassembly 160 that may be operative to selectively address individualdisplay pixels or display subpixels of the display. For example,light-generating selection circuitry 164 or otherwise of selectionsubassembly 160 may include any suitable active matrix or passive matrixthat may be electrically controlled (e.g., on a row by row or column bycolumn or pixel by pixel basis) to selectively transmit therethrough andtowards a particular portion of external surface 121 any light emittedfrom any light-generating component(s) 142 of light-emitting subassembly140 (e.g., if such a portion of selection subassembly 160 is positionedbetween light-emitting subassembly 140 and external component 120 or atany other suitable location of I/O interface assembly 111 a) and/or toselectively drive or otherwise enable one or more light-generatingcomponents 142 of light-emitting subassembly 140 to emit light towardsexternal surface 121 (e.g., if light-emitting subassembly 140 ispositioned between such a portion of selection subassembly 160 andexternal component 120 (e.g., in a top-emission structure) and/or iflight-emitting subassembly 140 is positioned adjacent such a portion ofselection subassembly 160 (e.g., in a coplanar bottom-emissionstructure) or at any other suitable location of I/O interface assembly111 a). Moreover, in some embodiments, as shown in FIG. 1C, for example,I/O interface assembly 111 a (e.g., touch assembly input component 110c) may include a touch sensing assembly 124 (e.g., between externalcomponent 120 and display assembly 130, or at any other suitablelocation of I/O interface assembly 111 a), where touch sensing assembly124 may be any suitable assembly operative to detect the position of oneor more touch events or near touch events (e.g., by user U or any othersuitable object in the external environment of device 100) alongexternal surface 121 (e.g., a resistive touchscreen, a surface acousticwave touchscreen, a capacitive sensing touchscreen, an infraredtouchscreen, an acoustic pulse recognition touchscreen, etc.). In someembodiments, display assembly 130 may be described as including or beingprovided with touch sensing assembly 124. Additionally or alternatively,in some embodiments, display assembly 130 may be described as includingor being provided with external component 120.

It is to be understood that, although I/O interface 111 a has beendescribed with respect to a “display” output component 112 a and a“display” assembly 130, in some embodiments, such features may beoperative to provide illumination of external surface 121 (e.g., to emitlight through external surface 121) for general illumination purposes,decorative purposes, or simple informational purposes rather than as aconventional display for high-resolution informational purposes. Forexample, one or more light-generating components 142 of light-emittingsubassembly 140 may be operative to illuminate external surface 121 ofexternal component 120 that may be provided through an opening inhousing 101 in the shape of a logo (e.g., through back wall 101 k) whendevice 100 is turned on (e.g., a light-up logo on the back of a laptopcomputer). In such embodiments, only a single light-generating component142 or a limited number of light-generating components 142 may need tobe provided by light-emitting subassembly 140.

I/O interface 111 a may also include any suitable ambient light-sensingsubassembly 150 (e.g., of ambient light sensor assembly input component110 a) underneath external component 120. Light-sensing subassembly 150may be provided by or in combination or in conjunction with any suitabledisplay assembly 130. Light-sensing subassembly 150 may be any suitablelight sensor assembly type that may be operative to receive and detectany suitable portion of ambient light AL from any suitable ambient lightsource(s) ALS in the environment of device 100 via external component120 (e.g., in the direction of arrow AL1) and/or any suitable portion ofinternal light IL from any suitable internal light source(s) internal todevice 100 (e.g., within housing 101), such as any suitable light fromany suitable light-generating component 142 (e.g., a portion of emittedlight EL). As shown in FIG. 1J, for example, light-sensing subassembly150 may include at least one light-detecting diode or any other suitablelight-detecting element or light-detecting component 152. Power supply108 may be configured to selectively interact with one, some, or eachlight-detecting component 152 for enabling the detection of lightthereat (e.g., via any suitable light-detecting selection circuitry(e.g., via any suitable light-detecting selection circuitry 165 ofselection subassembly 160 that may be electrically coupled to thelight-detecting component via any suitable coupling (e.g., bus 114))).Light-detecting component 152 may include any suitable light-detectingelement 151 (e.g., any suitable light-detecting diode PD (e.g., aphotodiode)) with at least two pins or nodes 151 a and 151 b that may beelectrically coupled with circuitry 165 of selection subassembly 160,which may include a first node O3 and a second node O4. A voltage may beapplied or measured across nodes O3 and O4. For example, light-detectingelement 151 may be biased (e.g., reverse biased) with an externalvoltage V (e.g., a calibration power characteristic value of voltage Vof light-detecting element 151), during which incoming detected ambientlight AL may increase the current (e.g., reverse current) flowingthrough light-detecting element 151, and such a magnitude of suchcurrent may be detected (e.g., by circuitry 165 of selection subassembly160) for determining a current brightness of light AL (e.g.,light-detecting element 151 itself may not be generating energy but maybe modulating the flow of energy from an external source, where such amode may be referred to as a photoconductive mode). A magnitude of acurrent flowing through light-detecting component 152 (e.g., as may bevaried by the magnitude of light AL detected by diode PD oflight-detecting element 151 of light-detecting component 152 whenvoltage V is applied across element 151 (e.g., at a semiconductorjunction J or otherwise of light-detecting element 151 (e.g., at ajunction or otherwise of anode A and cathode C of light detecting diodePD))) may be detected by circuitry 165 of selection subassembly 160 inany suitable manner (e.g., using any suitable circuitry components ofcircuitry 165 of selection subassembly 160 and/or processingcapabilities of processor 102), and such a detected magnitude of currentmay be used (e.g., by processor 102 (e.g., to determine any suitablecharacteristic of ambient light in an environment of device 100)). Asanother example, in the absence of external bias, light-detectingelement 151 may be operative to convert the energy of light AL intoelectric energy by charging the terminals of light-detecting element 151to a voltage (e.g., integrated onto the light-detecting element'scapacitance), whereby the rate of charge (e.g., as may be detected bycircuitry 165 of a selection subassembly 160) may be proportional to theintensity or brightness of incoming light AL (e.g., the energy may beharvested and then measured by draining the charge through an externalhigh-impedance path (e.g., through use of a switch 160 s of circuitry165 of selection subassembly 160), where such a mode may be referred toas a photovoltaic mode). As just one particular embodiment of circuitry165 of selection subassembly 160, as shown in FIG. 1J, circuitry 165 mayinclude a transimpedance amplifier or any other suitable component,which may include an amplifier component 160 p (e.g., a chargeamplifier), where an inverting input of amplifier component 160 p may becoupled to node 151 a, a non-inverting input of amplifier component 160p may be coupled to node O3, and the output of amplifier component 160 pmay be coupled to the inverting input of amplifier component 160 p andto cathode C of light-detecting element 151 via a filter component 160f, which may include a resistor-capacitor circuit RC. In someembodiments, switch 160 s may be provided to selectively couple ordecouple cathode C to and from the inverting input of amplifiercomponent 160 p. A voltage V (e.g., a constant voltage) may be appliedto node O3 and a current through light-detecting element 151 may bedetected or a voltage of circuitry 165 from light-detecting element 151may be detected that may be proportional to the current throughlight-detecting element 151.

Display assembly 130 may include one or more other components, such asany suitable light-detecting selection circuitry 165 of selectionsubassembly 160 that may be operative to selectively address individualsensor pixels or sensor subpixels of the display. For example,light-detecting selection circuitry 165 or otherwise of selectionsubassembly 160 may include any suitable active matrix or passive matrixthat may be electrically controlled (e.g., on a row by row or column bycolumn or pixel by pixel basis) to selectively enable detection of anylight received by any light-detecting component(s) 152 of light-sensingsubassembly 150).

I/O interface 111 a may include any suitable type of display assembly130 with any suitable combination of any suitable type of light-emittingsubassembly 140 and any suitable type of light-sensing subassembly 150and any suitable type of selection subassembly 160. Any suitablecombination of one or more light-generating components 142 of anysuitable light-emitting subassembly 140 and one or more light-detectingcomponents 152 of any suitable of light-sensing subassembly 150 and anysuitable selection subassembly 160 may be combined to provide displayassembly 130 of I/O interface 111 a that may be operative not only toemit internally generated light but also to detect ambient light (e.g.,simultaneously, alternatingly, or otherwise selectively (e.g., throughcontrol of selection subassembly 160 by any suitable processing (e.g.,through use of any suitable application 103 being run by processor102)). Each light-detecting component 152 of light-sensing subassembly150 may be positioned in a single layer or different light-detectingcomponents 152 of light-sensing subassembly 150 may be positioned indifferent layers. Light-emitting subassembly 140 may be, for example, aliquid crystal display (LCD display) or an organic light emitting diodedisplay (OLED display) or any other suitable type of display panel.Other types of displays can also be used. One, some, or eachlight-detecting component 152 of light-sensing subassembly 150 may beprovided or otherwise positioned in the same layer as one, some, or eachlight-generating component 142 of light-emitting subassembly 140. Forexample, one, some, or each light-detecting component 152 oflight-sensing subassembly 150 may be provided or otherwise positioned ina layer that may also include one or more of the LEDs (e.g., organicelement(s)) of an OLED display light-emitting subassembly 140 or one ormore of the pixel cells of an LCD display light-emitting subassembly 140(e.g., as shown in FIG. 1D). Alternatively or additionally, one, some,or each light-detecting component 152 of light-sensing subassembly 150may be provided by the same component as one, some, or each respectivelight-generating component 142 of light-emitting subassembly 140. Forexample, a single diode element may be provided as both a light-emittingelement 141 of a light-generating component 142 of light-emittingsubassembly 140 and a light-detecting element 151 of a light-detectingcomponent 152 of light-sensing subassembly 150 (e.g., a single diode maybe configured as an LED based on a first interaction or a firstelectrical coupling/decoupling with certain selection circuitry ofselection subassembly 160 and as a PD based on a second interaction or asecond electrical coupling/decoupling with certain selection circuitryof selection subassembly 160, where device 100 may be configured toselectively alternate between such first and second interactions (e.g.,through control of selection subassembly 160 by any suitable processing(e.g., through use of any suitable application 103 being run byprocessor 102)). As just one example, a particular OLED light-emittingelement 141 (e.g., an OLED that may be configured withTris(8-hydroxyquinolinato)aluminium (Al(C₉H₆NO)₃ or Al₃) or any othersuitable material (e.g., as an amorphous molecular organic thin film))may be operative to emit green light but also be sensitive for detectingblue light as a light-detecting element 151 (e.g., due to the phenomenaof the Stoke's Shift and/or the Franck Condon principle). For example,one or more of light-detecting components 152 of one or more of FIGS.1D, 1F, 1G, and 1H may be provided by a light-generating component 142that includes such a light-emitting element 141 that may also beconfigured by selection subassembly 160 as a light-detecting element 151(e.g., as shown by a light-emitting/light-detecting element 171 ofcomponent 152 7.N+1 of FIG. 1D that may be selectively operative (e.g.,by selection assembly 160 and/or processor 102) as either alight-emitting element 141 or a light-detecting element 151).Alternatively or additionally, one, some, or each light-detectingcomponent 152 of light-sensing subassembly 150 may be provided orotherwise positioned in a different layer than one, some, or eachlight-generating component 142 of light-emitting subassembly 140. Forexample, one, some, or each light-detecting component 152 oflight-sensing subassembly 150 may be provided or otherwise positioned ina layer of selection subassembly 160 (e.g., in a layer including athin-film-transistor (“TFT”) backplane or array (e.g., of an OLEDdisplay light-emitting subassembly 140 or of an LCD displaylight-emitting subassembly 140)) rather than in a layer including one ormore of the LEDs (e.g., organic element(s)) of an OLED displaylight-emitting subassembly 140 or one or more of the pixel cells of anLCD display light-emitting subassembly 140. In such embodiments, a holeor cut out may be provided through such a layer of light-emittingsubassembly 140 (e.g., through a layer including one or more of the LEDs(e.g., organic element(s)) of an OLED display light-emitting subassembly140 or one or more of the pixel cells of an LCD display light-emittingsubassembly 140) and/or such a layer of light-emitting subassembly 140may be terminated such that portion of the layer of selectionsubassembly 160 providing one or more of light-detecting components 152may not be blocked by such a layer of light-emitting subassembly 140(e.g., such that ambient light may be received by that portion of thelayer of selection subassembly 160 providing one or more oflight-detecting components 152) (e.g., as shown by a space 130″S createdby an early termination of layer 130″L2 in the −X direction of FIG. 1Eand/or by a passageway 130″P provided through layer 130″L2 of FIG. 1E).Functionalities of light-emitting subassembly 140 and functionalities oflight-sensing subassembly 150 can both be provided in a TFT layer (e.g.,of an LCD type display assembly 130 and/or of an LED type displayassembly 130). Additionally or alternatively, functionalities oflight-emitting subassembly 140 and functionalities of light-sensingsubassembly 150 can both be provided in an LED layer (e.g., of an OLEDdisplay assembly 130).

As an example of a particular type of display assembly that may beprovided by display assembly output component 112 a, as shown in FIGS.1D and 1F, a display assembly 130′ may be a light-emitting diode (“LED”)display assembly or any other suitable display assembly type that mayuse an array of light-generating components 142 provided by alight-emitting subassembly 140′ as pixels for the display. For example,as shown in FIGS. 1D and 1F, light-emitting subassembly 140′ of displayassembly 130′ may include an array of light-generating components 142arranged in rows and columns (e.g., in a matrix) underneath all or atleast a substantial portion of external surface 121 of externalcomponent 120, where each light-generating component 142 may beoperative to emit light towards a particular portion of external surface121. As just one example, as shown, light-emitting subassembly 140′ ofdisplay assembly 130′ may include an array or matrix of light-generatingcomponents 142 arranged in M rows R1-RM and N columns C1-CN, where rowR1 may include light-generating components 142-1.1 through 142-1.N, rowR7 may include light-generating components 142-7.1 through 142-7.N, androw M may include light-generating components 142-M.1 through 142-M.N,column C1 may include light-generating components 142-1.1 through142-M.1, column C2 may include light-generating components 142-1.2through 142-M.2, and column CN may include light-generating components142-1.N through 142-M.N (see, e.g., FIG. 1F). Each light-generatingcomponent 142 of light-emitting subassembly 140′ may be operative toemit light (e.g., along the +Z-axis) towards external component 120 forilluminating a particular pixel or a particular subset of pixels ofdisplay assembly 130′. Each light-generating component 142 oflight-emitting subassembly 140′ may be any suitable light-generatingcomponent 142 that may include any suitable light-emitting element 141,such as an OLED, nano-LED, micro-LED, and the like. For example, asshown in FIG. 1D, light-generating component 142-7.N may include alight-emitting element 141, which may include an LED cathode, abovewhich may be positioned an electron transport layer (“ETL”), above whichmay be positioned an emissive layer (“EML”), above which may bepositioned a hole transport layer (“HTL”), above which may be positionedan LED anode, which may be operative to emit light (e.g., when device100 provides a current for flowing from the cathode to the anode). Insome embodiments, each one of any two or more light-generatingcomponents 142 may be provided as a display subpixel and may be combinedto provide a single display pixel. For example, three adjacent (e.g.,horizontally adjacent, vertically adjacent, and/or otherwise adjacent)components 142 may be provided as display subpixels (e.g., red, green,and blue display subpixels) of a display pixel. As shown, for example,adjacent components 142-7.1, 142-7.2, and 142-7.3 may be displaysubpixels defining a display pixel P-7.1′.

Display subassembly 130′ may also include a selection subassembly 160′that may be operative to selectively enable transmission of light from aparticular light-generating component 142 of light-emitting subassembly140′ towards external surface 121 (e.g., an active or passive matrixthat may be electrically controlled (e.g., on a pixel by pixel basisand/or on a row by row or column by column basis) to selectivelytransmit light from one or more respective light-generating components142 of light-emitting subassembly 140′ towards a respective portion ofexternal surface 121 (e.g., using one or more respective circuitries 164or otherwise of selection subassembly 160′)). For example, displaysubassembly 130′ may be an LED display assembly with a selectionsubassembly 160′ that may include an active matrix, which may berealized using a thin-film-transistor (“TFT”) backplane or array, foraddressing individual pixels, although any suitable selection assemblymay be provided by display subassembly 130′ either above, below, orintegrated with light-emitting subassembly 140′. By controlling eachpixel of display assembly 130′ with selection subassembly 160′ (e.g.,via a display application being run by processor 102), a varying amountof light emitted by each respective light-generating component 142 oflight-emitting subassembly 140′ may be selectively allowed to illuminatea respective portion of external surface 121.

In some embodiments, as shown in FIG. 1D, for example, I/O interfaceassembly 111 a (e.g., touch assembly input component 110 c) may includetouch sensing assembly 124 between external component 120 and displayassembly 130′ (e.g., between external component 120 and selectionsubassembly 160′) or at any other suitable location of I/O interfaceassembly 111 a of FIGS. 1D and 1F, where touch sensing assembly 124 maybe any suitable assembly operative to detect the position of one or moretouch events or near touch events (e.g., by user U or any other suitableobject in the external environment of device 100) along external surface121 (e.g., a resistive touchscreen, a surface acoustic wave touchscreen,a capacitive sensing touchscreen, an infrared touchscreen, an acousticpulse recognition touchscreen, etc.). In some embodiments, displayassembly 130′ may be described as including or being provided with touchsensing assembly 124. Additionally or alternatively, in someembodiments, display assembly 130′ may be described as including orbeing provided with external component 120.

Additionally, as shown in FIGS. 1D and 1F, for example, display assembly130′ of I/O interface assembly 111 a may include a light-sensingsubassembly 150′ with one or more light-detecting components 152 thatmay be in the same plane as one or more light-generating components 142of light-emitting subassembly 140′. For example, while one, some, oreach one of light-generating components 142 of light-emittingsubassembly 140′ may include an LED element 141 (e.g., an organic LED(OLED) element), one, some, or each one of light-detecting components152 of light-sensing subassembly 150′ may include a photodiode element151 (e.g., organic photodiode (OPD) element), and those elements 141 and151 may be in the same plane or layer (e.g., with respect to theZ-axis). For example, as shown, light-generating components 142 oflight-emitting subassembly 140′ and light-detecting components 152 oflight-sensing subassembly 150′ may be provided in the same displayassembly layer 130′L2 of display assembly 130′ (e.g., in the sameorganic layer(s) for organic diode elements of those components (e.g.,above or below display assembly layer 130′L1 of display assembly 130′ inwhich any or all suitable circuitry of selection subassembly 160′ (e.g.,thin-film-transistor (“TFT”) backplane or array and/or circuitries 164and/or 165) may be provided)). In such a layer 130′L2, as shown, a firstlight-detecting component 152 may be provided just adjacent to the−X-most light-generating component 142 in the −X direction along theX-axis of each one of rows R1-RM (e.g., for providing a light-emittingcomponent 142 in each row along a column C0) and a secondlight-detecting component 152 may be provided just adjacent to the+X-most light-emitting component 142 in the +X direction along theX-axis of each one of rows R1-RM (e.g., for providing a light-generatingcomponent 142 in each row along a column CN+1). By providinglight-detecting components 152 of display assembly 130′ along the edges(e.g., along leftmost and rightmost columns (and/or along topmost and/orbottommost rows)) of an array or matrix of components 142/152, one,some, or each light-detecting component 152 may be positioned under anysuitable masked portion 120 m of surface component 120 of I/O interface111 a. Such an opaque masking layer (e.g., a layer of black ink (e.g., apolymer filled with carbon black or a layer of any suitable opaquemetal)) may be provided to help hide one or more of components 152 fromthe sight of user U (e.g., when those components 152 may be configuredonly for light detection rather than also for light emission), wheresuch a layer may be configured to allow any suitable ambient light AL topass therethrough for detection by one or more components 152 while atleast partially preventing user U from seeing component(s) 152. However,if a component 152 may also be configured to selectively act as alight-generating component (e.g., component 152-7.N+1 with alight-emitting/light-detecting element 171), then a masked portion maynot be provided above such a component. Although light-detectingcomponents 152 may be shown only to be provided in edge columns C0 andCN+1, it is to be understood that two or more adjacent edge columns maybe provided to include light-detecting components 152, and/orlight-detecting components may also be provided along edge rows R1 andRM such that light-detecting components 152 may be provided about theentire boarder or substantially the entire boarder of an array oflight-generating components 142 (e.g., where a mask (e.g., mask 120 m)may also extend about the entire boarder). At least when one or morelight-detecting components 152 may be provided along at least one edgeor otherwise not interspersed between various light-generatingcomponents 142, such light-detecting components 152 may be used fordetecting ambient light from any suitable ambient light source(s)concurrently with such light-generating components 142 being used foremitting any suitable display light for the user, where any suitablemask element (e.g., element 130 m of FIG. 1D) may be positioned betweenany two adjacent light-generating and light-detecting components forlimiting light generated by the light-generating component from beingdetected as ambient light by the light-detecting component.

Therefore, in some embodiments, one or more dedicated or specificallyconfigured light-detecting components 152 may be provided in the samelayer 130′L2 as one or more dedicated or specifically configuredlight-generating components 142, which may enable more efficientmanufacturing of assembly 130′ (e.g., a manufacturing process forproviding a layer 130′L2 with one or more OLED light-generatingcomponents 142 may not be significantly disrupted by adding one or moreOPD light-detecting components 152 to that same layer during themanufacturing process. Moreover, one or more dedicated or specificallyconfigured light-detecting selection circuitries 165 may be provided inthe same layer 130′L1 as one or more dedicated or specificallyconfigured light-generating selection circuitries 164, which may enablemore efficient manufacturing of assembly 130′ (e.g., a manufacturingprocess for providing layer 130′L1 with one or more light-generatingselection circuitries 164 may not be significantly disrupted by addingone or more light-detecting selection circuitries 165 to that same layerduring the manufacturing process (e.g., extending traces and/or columnsand/or rows of an active or passive selection control matrix, which maybe realized using a single thin-film-transistor (“TFT”) backplane orarray or the like). This may enable a more streamlined manufacturingprocess and more real-estate efficient display assembly.

As another example of a particular type of display assembly that may beprovided by display assembly output component 112 a, as shown in FIGS.1G and 1H, a display assembly 130′ may be a light-emitting diode (“LED”)display assembly or any other suitable display assembly type that mayuse an array of light-generating components 142 provided by alight-emitting subassembly 140″ as pixels for the display. For example,as shown in FIGS. 1G and 1H, light-emitting subassembly 140′″ of displayassembly 130′″ may include an array of light-generating components 142and light-detecting components 152 of a light-sensing subassembly 150′″of display assembly 130′″ arranged together in rows and columns (e.g.,in a matrix) underneath all or at least a substantial portion ofexternal surface 121 of external component 120. While a majority ofdisplay assembly 130′″ of FIGS. G and H may be the same as displayassembly 130′ of FIGS. D and F, light-detecting components 152 ofdisplay assembly 130′″ may be interspersed with light-generatingcomponents 142 within a layer 130′″L2 above layer 130′″L1 of displayassembly 130′″, as opposed to light-detecting components 152 of displayassembly 130′ that may be provided along one or more edges of displayassembly 130 within layer 130′L2. Therefore, as shown, a light-detectingcomponent 152 may be positioned in between two or more light-generatingcomponents 142, such that a display pixel may be configured to include alight-detecting component 152 (e.g., pixel P-7.1′″ may include not onlycomponents 142-7.1, 142-7.2, and 142-7.4, but also component 152-7.3,which may or may not be configured like component 152-7.N+1 with alight-emitting/light-detecting element 171 that may be selectivelyoperative (e.g., by selection assembly 160 and/or processor 102) aseither a light-emitting element 141 or a light-detecting element 151)and/or such that two display pixels may be separated by alight-detecting component 152.

As another example of a particular type of display assembly that may beprovided by display assembly output component 112 a, as shown in FIG.1E, a display assembly 130″ may be a light-emitting diode (“LED”)display assembly or any other suitable display assembly type that mayuse an array of light-generating components 142 provided by alight-emitting subassembly 140″ as pixels for the display. For example,light-emitting subassembly 140″ of display assembly 130″ may include anarray of light-generating components 142 and at least onelight-detecting component 152 of a light-sensing subassembly 150″ ofdisplay assembly 130″ arranged together in rows and columns (e.g., in amatrix) underneath all or at least a substantial portion of externalsurface 121 of external component 120. While a majority of displayassembly 130″ of FIG. E may be the same as display assembly 130′ ofFIGS. D and F, any one or more of light-detecting components 152 ofdisplay assembly 130″ may be provided by any suitable circuitry withinin a different layer than a layer in which one, some, or eachlight-generating component 142 of light-emitting subassembly 140″ may beprovided (e.g., in a layer different from layer 130″L2 in which one ormore or each light-generating component 142 of light-emittingsubassembly 140″ of display assembly 130″ may be provided). For example,one, some, or each light-detecting component 152 of light-sensingsubassembly 150″ of display assembly 130″ may be provided or otherwisepositioned in a layer 130″L1 within which any suitable circuitry ofselection subassembly 160″ of display assembly 130″ may be provided(e.g., in a layer including a thin-film-transistor (“TFT”) backplane orarray and/or circuitry 164 and/or circuitry 165 and/or the like ofselection subassembly 160″ of any suitable LED display assembly and/orof any LCD display assembly or any other suitable type of displayassembly) rather than in a layer including one or more LEDs (e.g.,organic element(s)) of an OLED display light-emitting subassembly 140″or one or more of pixel cells of an LCD display light-emittingsubassembly 140″. In such embodiments, as shown in FIG. 1E, a hole orcut or passageway 130″P may be provided at least partially or entirelythrough such a layer 130″L2 in which one or more or eachlight-generating component 142 of light-emitting subassembly 140″ ofdisplay assembly 130″ may be provided and/or a space 130″S may becreated by an early termination of layer 130″L2 (e.g., in the directionof FIG. 1E), such that one or more portions of layer 130″L1 and/or atleast one light-detecting component 152 of light-sensing subassembly150″ of display assembly 130″ may not be blocked by such a layer 130″L2(e.g., such that ambient light may be received by at least onelight-detecting component 152 of light-sensing subassembly 150″ ofdisplay assembly 130″ that may be positioned below layer 130″L2 (e.g.,within layer 130″L1) (e.g., such that at least a portion of ambientlight AL may be received by light-detecting component 152-7.0 oflight-sensing subassembly 150″ of display assembly 130″ may via space130″S and/or such that at least a portion of ambient light AL may bereceived by light-detecting component 152-7.N+1 of light-sensingsubassembly 150″ of display assembly 130″ may via passageway 130″P)).For example, at least a portion of component 152 and one or moreelements of circuitry 165 and/or one or more elements of circuitry 164and/or any other suitable circuitry of selection subassembly 160″ may beprovided in layer 130″L1. For example, each element of FIG. 1J may beprovided in layer 130″L1 that may extend below layer 130″L2 in which atleast a portion of component 142 of FIG. 1I may be provided. Forexample, at least a portion of a light-detecting component 152 may beprovided as an amorphous silicon detector or any other suitablephotosensitive circuitry in a TFT layer of a selection subassembly layerof the display assembly.

FIGS. 1D-1H are exemplary diagrams of certain ways in which one or morelight-detecting components 152 may be interspersed with or otherwisepositioned with respect to one or more light-generating components 142in a display assembly of an electronic device (e.g., with respect to aZ-axis (e.g., with respect to one or more layers of the displayassembly) and/or with respect to an X-axis and/or with respect to aY-axis (e.g., with respect to a surface 121). In some embodiments, atleast one light-generating component 142 may be at least partiallyprovided by a TFT pixel circuit that may create magnetic field whichcontrol the liquid crystals in an LCD display. Additionally oralternatively, at least one light-generating component 142 may be atleast partially provided by an organic LED in an OLED display. At leastone light-detecting component 152 may be at least partially provided bya diode generally configured as a transmitting diode (e.g., an LED) butthat may be selectively utilized as a receiving diode (e.g., a PD)and/or at least one light-detecting component 152 may be at leastpartially provided by a diode generally configured as a receiving diode(e.g., a PD) that may be designed and/or configured as a dedicatedlight-receiving feature of a display assembly. Different light-detectingcomponents 152 can include different types of diodes (e.g., a firstlight-detecting component 152 (e.g., component 152-7.0) may beconfigured to include only a receiving diode while a secondlight-detecting component 152 (e.g., component 152-7.N+1) may beconfigured to include a transmitting/receiving diode (e.g., diode 171)).Alternatively, in some embodiments, a light-detecting component 152 maybe configured to include at least two diodes, which may include at leastone receiving diode and at least one transmitting diode and/or at leastone transmitting/receiving diode.

Each light-detecting component 152 may be electrically coupled throughone or more transmission lines to a controller (e.g., processor 102),which may be configured to send signals to cause any light-transmittingelements to transmit light and to receive any signals from anylight-receiving elements. In some embodiments, the electricalcoupling(s) can be such that each light-detecting component 152 can beindividually controlled. As mentioned above, this can be achieved, forexample, using the same technique utilized for connecting the displaypixels of an LCD display (e.g., by using column and row transmissionlines and connecting the column and row transmission lines to atransistor at each light-detecting component 152). In some embodiments,each light-detecting component 152 may use its own dedicatedtransmission line. In other embodiments, each light-detecting component152 may share a transmission line with or of one or more neighboringlight-detecting components 152 and/or each light-detecting component 152may share a transmission line with or of one or more neighboringlight-generating components 142.

The light-emitting and light-sensing functions of a display assembly maybe time multiplexed. For example, one or more transmission lines can beused to control/energize one or more light-generating components 142 fora first time period, and then the transmission lines can be switched forcontrolling/energizing one or more light-detecting components 152 duringa second time period. Thus, use for the light-emitting and light-sensingfunctions can alternate. This multiplexing can be performed at asufficiently high frequency to prevent any noticeable flicker. Asmentioned, at least one light-detecting component 152 can be combinedwith one or more light-generating components 142 in a single pixel, suchas pixel P-7.1′″ of display assembly 130′″ of FIGS. 1G and 1H. Such apixel P-7.1′″ of display assembly 130′″ may include a light-detectingcell and one or more light-emitting cells (e.g., a red display cell, agreen display cell, and a blue display cell). Such a display assembly130′″ may be an LCD and/or TFT display, in which an LCD display, the R,G, and B cells or otherwise can be TFT pixel circuits that may createmagnetic fields that may control the liquid crystals in an LCD display.Such a display assembly 130′″ may be an OLED display, in which the R, G,and B cells or otherwise can be LEDs. In such embodiments of displayassembly 130′″, one, some or each one of components 142 and component152 may be individually controllable and may be electrically coupled toa controller (e.g., processor 102) through dedicated transmission lines,or they can share transmission lines neighboring components. Components142 and one or more components 152 can be operated concurrently or in atime multiplexed manner.

The various layouts of one or more of FIGS. 1C, 1D, 1E, 1F, 1G, and 1Hmay be a cost efficient way to add ambient light sensing functionalityto a display assembly of an electronic device, as a display assembly mayalready be a requirement to provide display functionality to such anelectronic device. Adding additional elements to a semiconductor layerof a display assembly (e.g., a layer including semiconductors of aselection subassembly of a display assembly and/or a layer including anysemiconductors of a light-generating component) that must already beproduced for the display assembly to present images to a user canrepresent a relatively low incremental cost. Furthermore, for certainOLED embodiments, it can be cost efficient to add light sensingfunctionality to an existing display, as this may only include addingone or more additional diodes (e.g., a dedicated PD and/or a combinedPD/LED) in an OLED layer that already primarily includes diodes. Theonly difference may be that the added diodes may be primarily configuredto receive light rather than transmit light. Each light-detectingcomponent 152 may be operative to detect ambient light that may bereceived via a portion of external component 120 that may proximate tothat light-detecting component 152. In some embodiments, one or morelight-detecting components 152 may be selectively disabled and enabled.Thus, any suitable controller of device 100 (e.g., processor 102) may beconfigured to selectively vary the number of active light-detectingcomponent 152 in order to save power (e.g., by reducing the number ofactive light-detecting component 152) and/or to improve ambientlight-sensing accuracy (e.g., by increasing that number and/or bylimiting the light-detecting components 152 that may be active to thosethat are positioned at least a certain distance away from any activelight-generating component 142 that may be emitting light EL that mightotherwise be detected by a proximate light-detecting component 152 asambient light AL). Thus, for example, only light-detecting components152-1.0 through 152-M.0 of column C0 may be activated andlight-detecting components 152-1.N+1 through 152-M.N+1 of column CN+1may be inactive for sensing ambient light when it is determined thatonly display pixels (e.g., one or more light-generating components 142)on the right hand side (e.g., closer to column CN+1 rather than closerto column C0) are emitting light (e.g., any light or light bright enoughto be detected as ambient light). Therefore, the current and/or pastand/or future condition of one or more light-generating components 142of a display assembly (e.g., the amount and/or color and/or brightnessand/or the like of one or more light-generating components 142) may beused to determine whether or not to activate one or more light-detectingcomponents 152 of the display assembly and/or to rely on the lightdetermined to have been detected by one or more light-detectingcomponents 152. Additionally or alternatively, any suitable physicalfeatures may be provided to attempt to prevent any light that may beemitted by one or more light-generating components 142 of a displayassembly and/or by any other light generated internally to device 100from being detected by one or more light-detecting components 152 of thedisplay assembly, such that light determined to have been detected bysuch light-detecting component(s) 152 may be relied on by device 100(e.g., one or more applications 103 of processor 102) as ambient light(e.g., light received from an environment external to device 100). Forexample, as shown in FIG. 1D, a mask element 130 m may be positionedbetween light-detecting component 152-7.0 and light-generating component142-7.1 of display assembly 130′ (e.g., to block at least a portion orall of any light emitted from light-generating component 142-7.1 ofdisplay assembly 130′ from being detected by light-detecting component152-7.0 of display assembly 130′. Device 100 may be configured todynamically determine a desired accuracy of light sensing depending on atask that is currently performed and may activate/deactivatelight-sensing components and/or light-generating components of a displayassembly accordingly in order to provide the desired accuracy whileconserving power. In some embodiments, each light-detecting component152 may be kept operational but information indicative of light detectedby different components 152 may be ignored or weighted differentlyaccording to how much internal light may be assumed to have been exposedto those different components 152. In other embodiments, light-detectingcomponents 152 can themselves be selectively turned on and off tocontrol power and granularity, because circuitry for processing thesignals produced by light-detecting components 152 may consume power. Insome embodiments, one or more light-detecting components 152 may beselectively used to conduct degradation sensing for one or morelight-generating components 142. For example, dynamic OLED compensationcan be done by illuminating various OLED cells 142 and sensing theirillumination levels with neighboring photodetector cells 152 (e.g., bysensing internal light IL (e.g., when it is known that there is noambient light or a consistent known level of ambient light detected bysuch photodetector cells)). Such sensing may be used to dynamicallydetect any degradation of the OLED cells over time and compensate forsuch degradation by over driving the OLED cells when degraded. In suchan example, illumination of such light-generating components 142 andsensing of such light-detecting component(s) 152 may be concurrent.

As a very particular example, FIG. 2 may be a diagram of an exemplarydisplay assembly 230 that may include light-emitting functionalities andlight-sensing functionalities. As shown, for example, display assembly230 may include several layers, including, but not limited to, abacklight layer 200, a polarizer layer 201, a thin film transistor (TFT)layer 203, a second polarizer layer 204, and/or a cover layer 205. Asdiscussed above, in some embodiments, one or more light-detectingcomponents 152 may be provided in a TFT layer of a display assembly. Inother embodiments, a separate light-sensing layer may be used for one ormore light-detecting components 152 of a display assembly. However, inyet other embodiments, a light-sensing functionality (e.g., one or morelight-detecting components 152) can be placed in one of layers 200, 201,203, 204, and/or 205. For example, one or more light-detectingcomponents 152 can be placed in color filter layer 203 so as to line upwith a mask 210 of TFT layer 1202. Mask 210 (e.g., a black mask) can bea mask placed between the various display pixels and/or cells (e.g.,components 142 and/or collections of components 142) of TFT layer 202.Thus, as shown in FIG. 2, mask barrier(s) 210 may separate displaypixels including one or more light-generating components 142. One ormore one or more light-detecting components 152 may be placed above oneor more of masks 210 in filter layer 203 or otherwise. Thus, one or morelight-detecting components 152 need not obstruct light passing frombacklight layer 200 through filter layer 203. In other embodiments, oneor more light-detecting components 152 can be placed in another layerabove one or more black masks 210, such as polarizer layer 204 and/orcover layer 205. One or more light-detecting components 152 can beplaced between display pixels in TF layer 202 or even between individualsubpixels within a pixel. In some embodiments, one or morelight-detecting components 152 can be placed in any of layers 200, 201,203, 204, and 205 but not lined up with any mask 210. Instead,alternative methods can be used to ensure that one or morelight-detecting components 152 do not interfere with any light-emittingfunctionalities of the display assembly. For example, one or morelight-detecting components 152 can be made of transparent material or ofa comparatively small size. In one or more embodiments, backlight layer200 can include an optical diffuser and one or more light-detectingcomponents 152 can be placed within such a diffuser.

While various embodiments of a display assembly with light-sensingfunctionalities and light-emitting functionalities may be discussedherein with respect to certain types of display technologies (e.g., LCDand OLED), they are not thus limited, but may encompass various otherdisplay technologies. While embodiments are discussed in connection withambient light-sensing, any other suitable type of light-sensing may beenabled by a display assembly. For example, one or more light-detectingcomponents 152 may be configured to sense UV light (e.g., a UV lightcomponent of ambient light), which may be utilized (e.g., by one or moreapplications 103 of processor 102 to detect UV light above a thresholdand alert a user of the electronic device that the user is being exposedto UV light that may be harmful (e.g., “please consider puttingsunscreen on, ambient light with a high UV index has been detected”)).An OLED component 142 may be reverse biased and UV photons, which mayhave significantly higher energy than visible light, may be detected bysuch a component 142, even by a non-optimized or dedicated UV detectingdiode, such as an OLED. Alternatively, a dedicated or optimized PDcomponent 152 or otherwise may be optimized to absorb UV light (e.g., aPD can be sensitive to any wavelength from UV to IR and can be tuned todetecting a specific type of light along the spectrum (e.g., optimizedto have a quantum efficiency of at least 70% for a particular type oflight)).

FIG. 3 is a flowchart of an illustrative process 300 for providingambient light sensing over a surface area. At operation 302 of process300, visible light may be emitted from a first plurality of locationsarranged underneath the surface area (e.g., one or more components 142of display assembly 130′ or of display assembly 130″ or of displayassembly 130′″ arranged underneath component 120 may emit visible light). At operation 304 of process 300, ambient light may be detected at asecond plurality of locations arranged underneath the surface area(e.g., one or more components 152 of display assembly 130′ or of displayassembly 130″ or of display assembly 130′″ arranged underneath component120 may detect ambient light AL).

It is understood that the operations shown in process 300 of FIG. 3 areonly illustrative and that existing operations may be modified oromitted, additional operations may be added, and the order of certainoperations may be altered.

FIG. 4 is a flowchart of an illustrative process 400 for operating adisplay assembly of an electronic device that includes an externalsurface of an external component and a processor component, where thedisplay assembly includes a plurality of light-generating components anda plurality of light-detecting components. At operation 402 of process400, the processor component may operate at least a subset of theplurality of light-generating components to create a visible image viathe external surface (e.g., processor 102 may operate one or morecomponents 142 of display assembly 130′ or of display assembly 130″ orof display assembly 130′″ to create a visible image via surface 121 ofcomponent 120). At operation 404 of process 400, concurrently withoperation 402, the processor component may operate at least a subset ofthe plurality of the light-detecting components to receive ambient lightvia the external surface (e.g., processor 102 may operate one or morecomponents 152 of display assembly 130′ or of display assembly 130″ orof display assembly 130′″ to receive ambient light AL via surface 121 ofcomponent 120). At operation 406 of process 400, the processingcomponent may receive one or more results signals based on the receivedambient light (e.g., processor 102 may receive signals based on lightreceived by one or more components 152).

It is understood that the operations shown in process 400 of FIG. 4 areonly illustrative and that existing operations may be modified oromitted, additional operations may be added, and the order of certainoperations may be altered.

FIG. 5 is a flowchart of an illustrative process 500 for manufacturing alight-sensing display assembly. At operation 502 of process 500 emitlight through the external surface. At step 502 of process 500, asemiconductor processing layer may be formed. At operation 504 ofprocess 500, a plurality of display element cells and at least onelight-sensing cell may be combined in the semiconductor processinglayer, wherein the display element cells are configured to emit orcontrol visible light for displaying images at a display and wherein theat least one light-sensing cell is configured to detect visible lightpassed through the display.

It is understood that the operations shown in process 500 of FIG. 5 areonly illustrative and that existing steps may be modified or omitted,additional operations may be added, and the order of certain operationsmay be altered.

Therefore, an electronic device need not provide an ambient light sensorassembly that is distinct from a display assembly of the device. Forexample, an opening distinct from opening 109 a through housing 101 forexposing an ambient light sensor assembly need not be provided, but,instead, an ambient light sensor assembly may be combined into a displayassembly that may be exposed by a single opening through the devicehousing and under a single external component through which devicegenerated light may be emitted from the display assembly to a user andthrough which ambient generated light may be passed and detected by thedisplay assembly. No additional layers may need to be added to a layerstackup of a display assembly in order to add the light-sensingfunctionalities. Instead, one or more light-detecting components may beprovided within a light-generating layer and/or within a selection orcontrol layer for a light-generating layer.

One, some, or all of the processes described with respect to FIGS. 1-5may each be implemented by software, but may also be implemented inhardware, firmware, or any combination of software, hardware, andfirmware. Instructions for performing these processes may also beembodied as machine- or computer-readable code recorded on a machine- orcomputer-readable medium. In some embodiments, the computer-readablemedium may be a non-transitory computer-readable medium. Examples ofsuch a non-transitory computer-readable medium include but are notlimited to a read-only memory, a random-access memory, a flash memory, acompact disc (e.g., compact disc (“CD”)-ROM), a digital versatile disk(“DVD”), a magnetic tape, a removable memory card, and a data storagedevice (e.g., memory 104 of FIG. 1). In other embodiments, thecomputer-readable medium may be a transitory computer-readable medium.In such embodiments, the transitory computer-readable medium can bedistributed over network-coupled computer systems so that thecomputer-readable code is stored and executed in a distributed fashion.For example, such a transitory computer-readable medium may becommunicated from one electronic device to another electronic deviceusing any suitable communications protocol (e.g., the computer-readablemedium may be communicated from a remote entity to electronic device 100via communications component 106 (e.g., as at least a portion of anapplication 103)). Such a transitory computer-readable medium may embodycomputer-readable code, instructions, data structures, program modules,or other data in a modulated data signal, such as a carrier wave orother transport mechanism, and may include any information deliverymedia. A modulated data signal may be a signal that has one or more ofits characteristics set or changed in such a manner as to encodeinformation in the signal.

It is to be understood that any, each, or at least one module orcomponent or element or subsystem of device 100 may be provided as asoftware construct, firmware construct, one or more hardware components,or a combination thereof. For example, any, each, or at least one moduleor component or element or subsystem of device 100 may be described inthe general context of computer-executable instructions, such as programmodules, that may be executed by one or more computers or other devices.Generally, a program module may include one or more routines, programs,objects, components, and/or data structures that may perform one or moreparticular tasks or that may implement one or more particular abstractdata types. It is also to be understood that the number, configuration,functionality, and interconnection of the modules and components andelements and subsystems of device 100 are only illustrative, and thatthe number, configuration, functionality, and interconnection ofexisting modules, components, elements, and/or subsystems of device 100may be modified or omitted, additional modules, components, elements,and/or subsystems of device 100 may be added, and the interconnection ofcertain modules, components, elements, and/or subsystems of device 100may be altered.

At least a portion of one or more of the modules or components orelements or subsystems of device 100 may be stored in or otherwiseaccessible to any portion of device 100 (e.g., in memory 104 of device100 (e.g., as at least a portion of an application 103)). For example,any or each module may be implemented using any suitable technologies(e.g., as one or more integrated circuit devices), and different modulesmay or may not be identical in structure, capabilities, and operation.Any or all of the modules or other components of device 100 may bemounted on an expansion card, mounted directly on a system motherboard,or integrated into a system chipset component (e.g., into a “northbridge” chip).

Any or each module or component of device 100 may be a dedicated systemimplemented using one or more expansion cards adapted for various busstandards. For example, all of the modules may be mounted on differentinterconnected expansion cards or all of the modules may be mounted onone expansion card. Any one or more of the modules may interface with amotherboard or processor 102 of device 100 through an expansion slot(e.g., a peripheral component interconnect (“PCI”) slot or a PCI expressslot). Alternatively, any one or more of the modules need not beremovable but may include one or more dedicated modules that may includememory (e.g., RAM) dedicated to the utilization of the module. In otherembodiments, any one or more of the modules may be integrated intodevice 100. For example, a module may utilize a portion of device memory104 of device 100. Any or each element or module or component of device100 may include its own processing circuitry and/or memory.Alternatively, any or each module or component of device 100 may shareprocessing circuitry and/or memory with any other module and/or elementand/or processor 102 and/or memory 104 of device 100.

While there have been described systems, methods, and computer-readablemedia for sensing ambient light with a display assembly, it is to beunderstood that many changes may be made therein without departing fromthe spirit and scope of the subject matter described herein in any way.Insubstantial changes from the claimed subject matter as viewed by aperson with ordinary skill in the art, now known or later devised, areexpressly contemplated as being equivalently within the scope of theclaims. Therefore, obvious substitutions now or later known to one withordinary skill in the art are defined to be within the scope of thedefined elements.

Therefore, those skilled in the art will appreciate that the concepts ofthe disclosure can be practiced by other than the described embodiments,which are presented for purposes of illustration rather than oflimitation.

1-22. (canceled)
 23. An electronic device comprising: a display assemblycomprising: an external display surface; a light-emitting componentoperative to emit light for illuminating the external display surface; alight-sensing component operative to detect light passing through theexternal display surface, wherein an element of the light-emittingcomponent and an element of the light-sensing component lie in a singlelayer extending along and underneath the external display surface; and amask operative to block at least a portion of any light emitted by thelight-emitting component from being detected by the light-sensingcomponent.
 24. The electronic device of claim 23, wherein the mask ispositioned between the element of the light-emitting component and theelement of the light-sensing component in the single layer.
 25. Theelectronic device of claim 23, wherein the display assembly furthercomprises a selection subassembly, and wherein the selection subassemblycomprises selection circuitry operative to selectively enable anddisable the light-emitting component's ability to illuminate theexternal display surface.
 26. The electronic device of claim 25, whereinthe single layer is positioned between the external display surface anda layer comprising the selection circuitry.
 27. The electronic device ofclaim 25, wherein the selection circuitry lies in the single layer. 28.The electronic device of claim 23, wherein the mask is operative toblock the at least a portion of any light emitted by the light-emittingcomponent from being detected by the light-sensing component withoutpassing through the external display surface.
 29. The electronic deviceof claim 23, wherein: the element of the light-emitting component is anorganic element of a light-emitting diode; and the element of thelight-sensing component is an organic element of a light-sensing diode.30. An electronic device comprising: a housing; a processor within thehousing; and a display assembly comprising: an external display surfaceexposed through an opening in the housing; a light-emitting componentcontrollable by the processor to emit light for illuminating theexternal display surface; a light-sensing component controllable by theprocessor to detect light that has passed through the external displaysurface; and selection circuitry, wherein: the light-sensing componentis provided within a backplane of the selection circuitry; and theselection circuitry is controllable by the processor to selectivelyenable and disable at least one of: the light-emitting component'sability to emit the light for illuminating the external display surface;or the light-sensing component's ability to detect the light that haspassed through the external display surface.
 31. The electronic deviceof claim 30, wherein the selection circuitry is controllable by theprocessor to selectively enable and disable the light-emittingcomponent's ability to emit the light for illuminating the externaldisplay surface.
 32. The electronic device of claim 30, wherein theselection circuitry is controllable by the processor to selectivelyenable and disable the light-sensing component's ability to detect thelight that has passed through the external display surface.
 33. Theelectronic device of claim 30, wherein the light-sensing componentcomprises an amorphous silicon detector.
 34. The electronic device ofclaim 30, wherein photosensitive circuitry of the light-sensingcomponent is provided in a transistor layer of the selection circuitry.35. The electronic device of claim 30, wherein the light-emittingcomponent is positioned between the external display surface and thebackplane.
 36. The electronic device of claim 35, wherein: thelight-emitting component is positioned in an intermediate layer betweenthe external display surface and the backplane; a passageway extendsthrough at least a portion of the intermediate layer; and thelight-sensing component is positioned below the passageway.
 37. Theelectronic device of claim 35, wherein: the light-emitting component ispositioned in an intermediate layer between the external display surfaceand the backplane; the intermediate layer extends in a first directionalong and underneath the external display surface until a terminationend of the intermediate layer beyond which exists an intermediate layerspace; and the light-sensing component is positioned below theintermediate layer space.
 38. An electronic device comprising: a displaysurface; an electrical layer; a plurality of display components in theelectrical layer, wherein the display components are configured to emitlight through the display surface; and at least one detect component inthe electrical layer, wherein the at least one detect component isconfigured to detect visible light passed through the display surface.39. The electronic device of claim 38, wherein the electrical layer is asemiconductor processing layer.
 40. The electronic device of claim 38,wherein the display components comprise display element cells configuredto emit visible light for displaying images at the display surface. 41.The electronic device of claim 38, wherein the at least one detectcomponent comprises a light-sensing cell configured to detect visiblelight passed through the display surface.
 42. The electronic device ofclaim 38, wherein a display pixel of the electronic device comprises:the plurality of display components; and the at least one detectcomponent.